產品資訊>無線產品/SiP模組>WM664-M
WM664-M
802.11b/g SiP Module
Introduction
Makers of cell phones, PDAs, tablet PCs, and other handheld devices can easily add full IEEE 802.11b/g functionality to their products with these fingernail-size system-in-package (SiP) modules in ball grid array (BGA) and land grid array (LGA) packages. Each module supports Secure Digital Input/Output (SDIO) internal buses; modules with additional Serial Peripheral Interface (SPI) support are also available. The WM664-M module is the perfect way to offer high-speed, worldwide wireless connectivity in handheld devices of all kinds.
Features and Benefits
  • Tiny Size and Multiple Interface Support
    Modules come in fingernail-size LGA surface-mount packages with 0.7-mm pad pitch for an even smaller footprint in high-density designs. SDIO 1.0 and SPI interfaces are implemented on each module.

  • Seamless Wireless Connectivity
    Each module supports the IEEE 802.11b and 802.11g standards for high speed and transparent interoperation with most home and business WLANs and all public hotspots throughout the world. It is equipped with two- and three-wire Bluetooth coexistence interfaces to allow concurrent WLAN and WPAN operation..


  • Up-to-date, High-level Security
    Both 64/128-bit WEP encryption and Wi-Fi Protected Access (WPA) are supported to ensure maximum data privacy.

  • Low Power Consumption
    The modules support both IEEE 802.11-compliant power saving mode and full-power-down mode to conserve battery power in mobile devices.

  • User-friendly Setup
    A graphical user interface is provided for easy configuration, monitoring, and management.


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    Application Scenario