of cell phones, PDAs, tablet PCs, and other handheld
devices can easily add full IEEE 802.11b/g functionality
to their products with these fingernail-size system-in-package
(SiP) modules in ball grid array (BGA) and land
grid array (LGA) packages. Each module supports
both CompactFlash Plus (CF+) and Secure Digital
Input/Output (SDIO) internal buses; modules with
additional Serial Peripheral Interface (SPI) support
are also available. WM600 series modules are the
perfect way to offer high-speed, worldwide wireless
connectivity in handheld devices of all kinds.
Features and Benefits
Tiny Size and Multiple Interface Support
Modules come in fingernail-size BGA surface-mount
packages with 0.8-mm ball pitch, as well as LGA
packages for an even smaller footprint in high-density
designs. Full CF+ and SDIO 1.0 interfaces are
implemented on each module; SPI support is also
provided on some models.
Each module supports the IEEE 802.11b and 802.11g
standards for high speed and transparent interoperation
with most home and business WLANs and all public
hotspots throughout the world. All are equipped
with two- and three-wire Bluetooth coexistence
interfaces to allow concurrent WLAN and WPAN operation.
Up-to-date, High-level Security
Both 64/128-bit WEP encryption and Wi-Fi Protected
Access (WPA) are supported to ensure maximum data
The modules support both IEEE 802.11-compliant
power saving mode and full-power-down mode to
conserve battery power in mobile devices.
A graphical user interface is provided for easy
configuration, monitoring, and management.